1 LVC-5570-7c fanless in-vehicle computer with intel core i7-3517ue processor features fanless design with corrugated aluminum the corrugated aluminum casing allow heat to dissipate off the top of the platform allowing for a fanless design. design for mil-std-810g with extreme vibration resistance LVC-5570 is in compliance with mil-std-810g in vibration and shock with ssd storage. the suspension kit is also available for further harsh environment. vehicle ignition power management detect the ignition on/off status and allow controlling delay time by fexible setting via utility. design for extreme operating temperature this product is ruggedized to support a wider than usual range of temperatures. outftted with industrial components (ssd, memory) this appliance can thrive in harsh conditions. diversity of digital input/ output support besides 4x di, 3x do with 12v ttl level for easy usage with vehicle parts., additionally lvc- 5570 supports 2x di (5v ttl for mcu) which can connect sensors to detect the environment. once certain events occur, LVC-5570 can be turned on automatically. 4x usb removable hdd/ssd removable hdd/ssd antenna 9~36vdc power in 2x usb dc in/out 2x lan vga dvi-d hdmi dual sim 3g audio 2x com pc audio mio connect@lannerinc.com
2 3g voice communication this vehicle pc supports 3g voice communication which allows people can communicate with operating center through voice directly. (validated mc- 8090/8092 3g module only) convenient dc output LVC-5570 offer 9~36vdc (max 10a) output for external devices. it can be enabled or disabled via software. dual front access sim card reader the external sim card readers, allowing end-users to change or install a sim card without opening the case. dimensions: 276.52 x 190 x 85.26 mm 276.52 308 85.26 28.6 190 www.lannerinc.com
3 dimensions (wxhxd) 276.52 x 85.26 x 190 mm processor intel core i7-3517ue processors chipset intel hm65 system memory technology ddr3 so-dimm x2 max. capacity up to 16gb storage sata removable 2.5 15mm ssd/hdd drive bay x2, msata x1 ethernet controller intel 82574l x2 graphic controller intel gma 3659 audio controller realtek alc886 hd codec io lan gbe rj45 x2 display dvi-d, maximum resolution up to 1920 x 1200 @60 hz vga, maximum resolution up to 2048 x 1536 @75 hz hdmi, maximum resolution up to 1920 x 1200 @60 hz dual display function supports independent, clone and extended mode.(vga+dvi or vga+hdmi) audio 1x mic-in and line-out (for pc) with 2 watt 1x mic-in and line-out (for validated mc-8090/8092 3g module) under db9 female connector serial i/o 2x rs-232/422/485 with ri/5v/12v gps ublox neo-7n gps receiver module g-sensor adxl 345 gpio 4x di 12v ttl level 3x do 12v ttl level 2x di (for mcu) 5v ttl level usb 2.0 type a x6 power input 3-pin terminal block (+, -, ignition) expansion mini-pcie x4 with 3 sim card readers others external: 10x sma antenna hole, reset, remote power switch 9~36vdc (max. 10a) output software on/off controlable power input +9~36vdc input range, atx mode support ignition delay on/off control ac adapter ordering option os support windows: wes 2009/ xp pro fes wes7(ws7e)/w7 pro sp1 / we8 std, linux: redhat enterprise 5, fedora 14, linux kernel 2.6.18 or later certifcations ce, fcc class a, e13, rohs compliance vibration: mil-std-810g, method 514.6 shock:mil-std-810g, method 516.6 operating temperature range extended with industrial components -30~60c/-22~140f standard with commercial components -5~45c / 23~113f connect@lannerinc.com specifcations
4 LVC-5570-7c intel? core i7-3517ue in-vehicle computer, ddr3 so-dimm x2, onboard 8gb ssd chip, 2.5 removable drive bay x2, mini-pcie x4 with three sim card reader, intel gbe x2, usb x6, com x2, pc audio, multiple i/o via db-15 cable integrated dix4, dox3, remote power button and 12vdc output reserved for accessory, dc power input +9~36vdc with ignition, video external cable included, suspending kit included. ordering information www.lannerinc.com
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